Prototype PCB Manufacturing Process – A Step by Step Guide

 The complete Prototype PCB manufacturing process is based on the design package that makes the circuit board in physical form.

Step 1: Pre-Production Engineering

According to the manufacturing data and requirements provided by the customer, our engineers will compare it with standards and capabilities to ensure compliance and conduct related checks.

Step 2: Photo Plotting

A laser photo-plotter can be used to plot a film for each individual layer. A laser photo-plotter is a tool used to create photo tools for solder masks and silkscreen.

Step 3: Imaging and Develop or Etch

This process applies the primary images such as pads and traces onto the circuit board. Here is what to do in this step: Apply the photo image to the copper panels. Furthermore, image the panels using LSI. Etch off the whole exposed copper from the panel. Strip the remaining Dry Film and just leave the remaining copper pattern for the inner layers.

Step 4: Automated Optical Inspection

AOI basically inspects different layers of multilayer PCB before laminating all layers together. The optics compare the PCB design data to the actual image on the panel.

Step 5: Oxide

Oxide is a chemical treatment to the inner layers before lamination for multi-layer PCBs. It is an important step to increase the roughness of copper to enhance the laminate bond strength.

Step 6: Lamination

Different layers of epoxy-infused fiberglass are laminated to produce a multilayer PCB. The pressure and heat cause the fiberglass sheet to melt and tightly join the layers.

Step 7:Drilling

All PCBs need holes to link copper layers, attach components, and mount the PCB. We can drill holes using some advanced drilling systems. Furthermore, these have a design for the fast removal of chips in abrasive materials.

Step 8: Electroless Copper Deposition

After drilling, manufacturers deposit a thin coat of copper on the exposed surfaces of the panels chemically. Furthermore, they deposit a copper coat on the hole walls using electroless plating.

Step 9: Dry Film Outer Layer

After copper deposition, you must apply the outer layer images to prepare the panel for the electroplate. So we can utilize a laminator machine to coat outer layers with the dry film. The dry film is a photo-imageable material.

Step: 10 Plate

The electroplating process involves copper plating onto the conductive pattern. Plus on the hole walls of the PCB as well. The thickness of the plating is around 1 mil. After copper plating, you need to deposit a thin layer of tin plating.

Step 11: Striping and Etching

After completing the plating process on the panel, the dry film remains. Then, remove the uncovered area of copper with tin. So traces and the pads around the holes and copper patterns remain there. At last, remove the remaining tin that is covering holes and traces chemically.

Step 12: Surface Finish

It is the last and final chemical process to manufacture a multilayer printed circuit board. Solder mask covers almost all circuitry. So the surface finish prevents oxidation of the remaining exposed copper area. 

Pcbcircuit is the largest PCB manufacturer in India. With industry-leading equipment and advanced technology, they can provide a wide range of PCB manufacturing services, from engineering, PCB fabrication, and PCBA, to quality control and other value-added services.